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Back grinding protective tape for semiconductor wafers
Back grind tape is used to protect the circuit surface from scratches, chipping, cracking, and contamination caused by external foreign substances during the back grinding process of the wafer. - Excellent adhesion to uneven wafers such as circuit surfaces - Excellent peelability
High adhesion to prevent water infiltration! We offer two types of protective tape for back grinding processes: UV type and Non-UV type!
D&X Corporation offers "Back Grind Tape." We provide two types of protective tapes for the back grind process: a UV type that allows tape removal without stressing the wafer due to reduced adhesive strength from UV exposure, and a Non-UV type with low adhesion for gentle removal. We also accommodate specification changes and the development of new types based on your requests. We can handle prototypes starting from small quantities, so please contact us for inquiries. 【Features】 ■ High adhesion that prevents water ingress ■ No adhesive residue, preventing contamination of the substrate ■ High flatness for grinding processes ■ Conforms to uneven surfaces *For more details, please refer to the PDF document or feel free to contact us.
Achieves stable low particle characteristics, eliminating the need for cleaning processes! Adheres closely to the uneven surfaces of the wafer circuit!
The "Back Grind Tape" is a tape that can protect the circuit surface during the grinding of the wafer's backside. Designed with an adhesive that does not require a cleaning process, it combines low particle generation and stable grindability. It has minimal changes in adhesive strength over time, ensuring stable release properties. 【Features】 ■ Excellent adhesion to the unevenness of the wafer circuit surface ■ Stable grindability during back grinding (low TTV) ■ Eliminates the need for a cleaning process by achieving stable low particle characteristics ■ Minimal changes in adhesive strength over time, ensuring stable release properties *For more details, please refer to the PDF document or feel free to contact us.
